The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 bln in 2007 and grow to $20.2 bln by 2011, according to a new study by SEMI and TechSearch International. Laminate substrates remain the largest segment of the market, worth an estimated $6.2 bln globally in 2007, and on a unit basis are projected to grow at a compound annual growth rate of over 12% over the next five years.
| Semiconductors packaging market estimated revenues in 2007 | |
| Segment | Revenues, mln. |
| Laminate Substrates | $6,196.0 |
| Flex Circuit/Tape Substrates | $262.5 |
| Leadframes | $3,118.0 |
| Bonding Wire | $3,178.3 |
| Mold Compounds | $1,371.0 |
| Underfill Materials | $138.0 |
| Liquid Encapsulants | $117.0 |
| Die Attach Materials | $562.2 |
| Solder Balls | $265.0 |
| Wafer Level Package Dielectrics | $9.8 |
| Thermal Interface Materials | $303.0 |
| Source: TechSearch International | |