Semiconductor packaging materials to generate $15.5 bln in 2007
The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 bln in 2007 and grow to $20.2 bln by 2011, according to a new study by SEMI and TechSearch International. Laminate substrates remain the largest segment of the market, worth an estimated $6.2 bln globally in 2007, and on a unit basis are projected to grow at a compound annual growth rate of over 12% over the next five years.
|Semiconductors packaging market estimated revenues in 2007|
|Flex Circuit/Tape Substrates||$262.5|
|Die Attach Materials||$562.2|
|Wafer Level Package Dielectrics||$9.8|
|Thermal Interface Materials||$303.0|
|Source: TechSearch International|