Flip chip packaging is currently growing at a 28% compound annual rate, and the lithography and etch market will be major beneficiaries, The Information Network reports. In 2005, flip chip grew to 5.3% of all ICs shipped ? 5.9 bln out of 111.0 bln. In 2009, flip chip will double to 10.6% of all ICs shipped ? 16.7 bln out of 156.9 bln, a compound annual growth rate (CAGR) of 28.1%. In contrast, unit shipments of all ICs are only growing at a compound annual rate of 7.1% through 2009. The overall market for bumping and advanced packaging equipment is growing at a rapid pace. The lithography market is projected to grow to more than $50 mln in 2009, a CAGR of 32%. The market will grow 75% in 2006, as demand for advanced packaging products continues to drive the growth of the market. The UBM wet etch tool market will exhibit a CAGR of 49%, growing to nearly $100 mln in 2009.